Product

- STANDARD 

Standard PCB is the most common used type of boards in number of applications, and subsequently the most common produced type in Asia, Europe and also America. We are able to deliver prototypes in 3 working days and volumes in 15 working days.
- FR4, High Tg, Halogen free
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.2-6.0mm
- 1-36 layers
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control)
- IPC Class II and III

- HDI

HDI (High Density Interconnect) are PCBs designed when space is scarce, like in mobile phones and handhelds, and also in more advanced industrial applications. The main difference is inside the thinner conductors and called blind via (not fully penetrating holes). We're able to deliver prototypes from 5 working days and volumes in 20-25 working days.
- FR4, High Tg, Halogen free
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.3-6.0mm
- 4-36 layers
- Blind, Burried, Stacked vias and back drilling
- Resin/copper filled blind vias, sequential build-up
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control) 
- IPC Class II and III

- FLEX 

Flexible PCB are usually used for simple electric designs where the dynamic or static bend ability is utilised. There is also the alternative “Bend-Flex” where the board maintains its shape after bending. Stiffeners by either polyimide or FR4 for connectors and other access points is being the standard. We're able to deliver prototypes from 5 working days and volumes in 20-25 working days.
- Polyimide, Polyester, Adhesiveless technology
- Stiffener FR4, Polyimide
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness from 12um
- Board thickness from 20um
- 1-12 layers
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control)
- IPC Class II and III

- Rigid-Flex

Rigid-flex boards are designed for applications where dynamic dependability is called for or when the design demands a non-planar mounting, as the case for telephones, computers, and also in more advanced industrial applications. These boards have much better electric properties and compares to traditional PCBs, also make possible a lighter end product. It is unusual to use HDI in combination. We're able to deliver prototypes from 7 working days to volumes in 25-30 working days.
- FR4, Polyimide, Polyester, Adhesiveless technology
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.012-6.0mm
- 1-14 layers
- Blind, buried, stacked vias
- Resin/copper filled blind via, sequential build-up
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control)
- IPC Class II and III